At present, laser cutting technology is mainly used for cutting wafer and chip cutting. High Precision Fiber Laser Cutting Machine cutting because of its non-contact processing, no stress, so can ensure a greater degree of raw material without damage, will not damage the internal wafer structure, product cutting quality is much better than other ways of cutting. At the same time, High Precision Fiber Laser Cutting Machine slit width is small, high precision, laser power is adjustable and other characteristics, also makes the application of laser precision cutting technology can control the cutting thickness, so as to realize the thinning of solar cells.
High Precision Fiber Laser Cutting Machine is mainly used in the cutting and scribing of solar panels, including silicon wafer, amorphous silicon film battery anti-reflection scribing, amorphous silicon film edge clearing, amorphous silicon film scribing, solar industry monocrystalline silicon, polysilicon, amorphous silicon cell and silicon wafer scribing (cutting scribing) and grooves.